The 2022 IEEE International Conference on Robotics and Biomimetics (IEEE ROBIO 2022) will take place from Dec. 5 to 9, 2022 in Xishuangbanna, China. The objective of this conference is to provide a forum for researchers in the interdisciplinary areas of robotics and biomimetics to disseminate their latest research results and explore the opportunity of research collaboration. The scope of ROBIO 2022 covers research, development and applications in all areas related to robotics, biomimetics, etc. Xishuangbanna is an autonomous prefecture for Dai people in the extreme south of Yunnan Province, China, bordering both Myanmar and Laos. Xishuangbanna is rich in nature, historical and cultural resources, noted for its folklore, rain forests, rare plants, and wildlife. The 2022 ROBIO will provide the participants an opportunity to enjoy the fantastic scenic spots and the unique culture of the minority nations of Xishuangbanna in addition to technical programs.

Contributed Papers: Original papers are solicited in all related areas related to robotics, biomimetics, etc. Full papers must be submitted in PDF format prepared strictly following the IEEE PDF Requirements for Creating PDF Documents for the IEEE Xplore. For detailed format information, please visit the conference website. All accepted papers are expected to be included in IEEE Xplore and will be indexed by EI.

Tutorials & Workshops: Proposals for tutorials and workshops addressing new topics in Robotics and Biomimetics are invited for submission to the T/W chair.

Journal Publications: Expanded versions of the accepted and presented papers with high quality will be invited for publication in related journals.

Important Date:

Submission of original PDF full papers: Aug. 30, 2022 (Deadline is extended due to requests from many authors.)
Submission of organized session proposals: Oct. 1, 2022
Notification of paper and organized session acceptance: Oct. 15, 2022
Submission of final papers and advance registration: Nov. 1, 2022

Contact Email: IEEEROBIO2022@gmail.com.